Huawei is holding a keynote on Saturday (September 2) at IFA 2017 in Berlin, Germany, during which the company is expected to announce the next generation of its flagship SoC, the Kirin 970.
Although Huawei is yet to make an official statement on the existence of the new processor, a report from AnandTech claims to have spotted an exhibit on the IFA show floor for the new processor.
According to the report, the Kirin 970 is built by TSMC using its 10nm manufacturing process. It is an octa-core processor, with a 12-core GPU, dual-ISP and a high speed Cat 18. LTE modem. There is also a dedicated AI computing unit that will be capable of delivering 25x the performance, compared to similar CPU based AI workloads, with 50x more power efficiency.
The new Kirin 970 SoC is also said to enable smartphones to offer real time image recognition, voice interaction, and intelligent photography, all while eating up less energy.
Although not a lot about the new processor is revealed, the rumours suggest that the octa-core CPU used is similar as the Kirin 960, with four ARM Cortex-A73 cores and four ARM Cortex-A53 cores, clocked at 2.4 GHz and 1.8 GHz respectively.
The GPU is expected to be the Mali-G72 which was showcased earlier this year along with Cortex-A55 and the Cortex-A75.
The dual-ISp offers motion detection capabilities, low light photography upgrades and HDR10 support with 4K60 decoding, 4K30 encoding.
